Ceramic:

ECC & ECK Series **ENGINEERING CHANGE**

05/17/02

General Package Marking Change

01/20/00

ECJ Series MLCC Part Number Change to reflect an increased quantity per reel of certain Case

10/07/04

ECJ Series MLCC Part Number Change to reflect a higher rated voltage part to take the place of a lower rated part

10/07/04

MLCC:

Change of 0201 MLCC (ECJ-ZExxxxxxx) Packaging Specifications

03/23/06

Film Cap:

Moisture-Proof Packaging for ECW-U and ECP-U Series Surface Mount Film Capacitors

04/11/13

ECQ-V(M) Series Country of Origin Change

12/12/11

Radial leaded Aluminum Foil Film Capacitors, ECQ-B, ECQ-P, ECH-S, ECQ-M, ECQ-F Series - NCNR

01/05/08

Aluminum Foil Thickness **Engineering Change**

10/31/02

ECW-U(X)(C): Stacked Metallized PEN Film Chip Capacitor

06/01/06

Electrolytic:

EEE Series SMT Aluminum Electrolytic Capacitors Packaging Change for Panasonic Industrial Devices Malaysia (PIDMY)

07/6/12

SMT Aluminum Electrolytic Capacitors Country of Origin Change

1/4/12

Insulation Casing for Electric Double Layer Capacitor (Gold Cap)

12/10/10

Embossed Tape and Reel Electric Double Layer Capacitor (Gold Cap)

12/10/10

PIC - Product Change Notice - PEDMA Bar Code System (Label Change)

11/19/10

Change of sleeve material from PVC to PET in Radial Electrolytic Capacitors - ***Engineering Change***

07/06/04

Large Can and
Screw Terminal:

Large Can V-Chip Reel Material Change

12/10/10

Changing Part Numbering System for Screw Terminal Type Electrolytic Capacitor
***Engineering Change Notice***

07/08/04

SP-Cap:

Moisture-Resistant Packaging Change
***Engineering Change Notice***

02/24/09

Tape Sealing Method Change
***Engineering Change Notice***

10/15/07

Molding Resin Material Changing to Halogen-Free Type
***Engineering Change Notice***

10/15/07

Standardization of Desiccant Packaging
***Engineering Change Notice***

09/20/06

EMI Filters,
Arrays & Networks:

EXC-CET Series Modification

08/01/11

Engineering Change Notice, 2 mode noise filter, EXC24CB/CP Series

02/02/05

Engineering Change Notice, Chip Bead Array, EXC228BB/BA Series

05/16/05

Resistors:

ERJ Series Standard Thick Film Resistors – Country of Origin Change on select part numbers.

07/02/12

EXB-28V, -2HV, -34V, -38V Order and Shipment Change

08/06/09

ERG-1S & ERX-1S MarkingChange

03/20/01

EROS2PHFxxxx, ERDS2TJxxxV Packaging Qty. Change

07/25/03

ERJ-M Label Position Change

01/06/03

Trimmers:

EVN5ES/EVN5CES Material Change

02/03/00

Potentiometer:

Part number change for particular Position Sensor from the EVAW7 product family.

03/20/06

Light Touch:

Select Light Touch Switch Series Production Shift Notice

12/04/12

Part number change for particular Light Touch Switch from the EVQ-P6 product family.

08/04/07

Part number change for particular Light Touch Switch from the EVQ-QW/PJ/P1/PC product families.

05/18/06

Part number change for particular Light Touch Switches from the EVQ-QF product family.

03/20/06

EVQ Light Touch General Notice

12/24/98

EVQ11 Series of Light Touch Switches (LTSW) to change production location.

01/18/05

Power Switches:

ESB-92S, ESB-92D, Push-type power switches are now not recommended for new designs.

10/30/06

Slide Switches:

Slide switches are not recommended for new designs

10/22/07

Detector Switches:

ESE-18 Series Select Part Number material Change

07/26/12

Part number change for particular ESE13 detector switch.

03/20/06

Part number change for particular Detector Switch from the ESE-21 product family.

03/20/06

Bluetooth:

Panasonic RF Modules – PAN13xx Series “J” Parts Based On Texas Instruments Silicon – Not recommended for new design

3/29/13

Bluetooth ETU Series Part Number Change

03/26/12

Mesh Networking:

Product Specification change regarding corporate logo & factory location, of the 2.4GHz band LR-WPAN module (PAN802154HAR00)

06/14/06

Surge Absorbers:

EZJSxxxxxxZ **ENGINEERING CHANGE**

02/26/04

Choke Coils

Power Choke Coil MC ETQ-P4LR, Reel Size MOQ and Incremental Quantity Change

02/24/09

Power Choke Coil ETQ-P6FxxxBFA Manufacturing Location Change

03/23/06

Power Choke Coil ETQ-P5LxxxXFA Manufacturing Location Change

03/23/06

ELK-UxxxFB (Packaging Material)
**ENGINEERING CHANGE**

07/10/02

Inductors / Coils

Additional Manufacturing Location of these 0402, & 0201 Case Size Chip Inductors; 0402 (RF, QF, PF) & 0201 (RG) Series

11/09/04

Filters

ELF-xxNxxxx Series AC Line Filter Transfer of Production Singapore/Batam Island, Indonesia to Jiangmen, China

10/19/12

ELF-21CxxxA, ELF-25CxxxA, and ELF-25CxxxF Manufacturing location change for Line Filter Series Types

05/23/06

Microphones:

Production Site Change for 6mm Microphones

01/24/05

Speakers:

EAS-3P127A Speaker RoHS Compliance

07/24/06

Labeling:

RoHS Compliance Labeling – JEITA Standard ET-7001

11/17/05

Multi-Layer:

Change of 0201 Multi-layer Thermistor (ERT-JZxxxxxxx) Packaging Specification

02/01/08

LED:

LED LNJxxx Series Product Change Notice - Vendor Change

02/20/13

Product Change Notice - Vendor Change

02/13/13